Alloy Database for Micro-Solders
Ag, Al, Au, Bi, Cu, In, Ni, Pb, Sb, Sn and Zn
– Thermodynamic database for multi-component micro-soldering alloy systems (Pb-containing/Pb-free).
- The current ADAMIS solder database consists of 11 components: Ag, Al, Au, Bi, Cu, In, Ni, Pb, Sb, Sn, and Zn. These components account for most of the alloying and micro-alloying elements appearing in commercial micro-soldering alloy systems.
- The current ADAMIS solder database consists of 122 phases, which covers most of the phases appearing in commercial micro-soldering alloys.
- The current ADAMIS solder database has been tested with many commercial micro-soldering alloys, such as Sn-Ag-X, Sn-Cu-X, Sn-In-X, Sn-Zn-X based alloy, and also Cu-X-Y based alloy systems.
Comparison of the calculated isothermal sections of the Sn-Ag-Cu ternary system at 400 and600°C with the experimental data
This example shows the calculated isothermal sections of Sn-Ag-Cu ternary system at 400 and 600oC comparing with experimental data. The calculated phase boundaries describe the experimental data very well.
Calculated isopleth of the Sn-Ag-Cu system at 10 wt.% Sn with experimental data
The calculated isopleth of Ag-xCu-10Sn (wt.%) with the experimental data. Reasonable agreement is achieved between thermodynamic calculation and experimental measurements.
Calculated liquidus projection of the Sn-Ag-Cu system at the Sn-rich region
The calculated liquidus projection of the Sn-Ag-Cu at the Sn-rich region. The arrows indicate the temperature-decreasing direction.
The current ADAMIS solder thermodynamic database is developed by Materials Design Technology and Tohoku University, Japan.