Publications on Solder Materials

CALPHAD-guided optimization of the microstructure of Sn–Sb–Cu bearing alloys
Yi, H., Dong, B., Wu, Z., Ke, C., Jie, J. and Li, T.
(2022) Materials Chemistry and Physics 290: 126627
https://doi.org/10.1016/j.matchemphys.2022.126627

High-strength Sn–Bi-based low-temperature solders with high toughness designed via high-throughput thermodynamic modelling
Yang, C.-h., Liu, Y.-c., Hirata, Y., Nishikawa, H. and Lin, S.-k.
(2022) Science and Technology of Welding and Joining 27(7): 572-578
https://doi.org/10.1080/13621718.2022.2085991

Mechanical properties of Sn-Bi-Ag low-temperature Pb-free solders
Yang, C. H., Liu, Y. C., Hirata, Y., Nishikawa, H. and Lin, S. K.
(2022) 2022 International Conference on Electronics Packaging (ICEP)
https://doi.org/10.23919/ICEP55381.2022.9795572

Study of thermal properties and microstructure of the Ag–Ge alloys
Manasijević, D., Balanović, L., Marković, I., Gorgievski, M., Stamenković, U., Minić, D., Premović, M., Đorđević, A. and Ćosović, V.
(2022) Journal of Thermal Analysis and Calorimetry 147(3): 1955-1964
https://doi.org/10.1007/s10973-021-10664-y

On formation of intermetallic compounds at the Copper /Niobium-Titanium interface
Karpati, V., Korozs, J., Kaptay, G. and Mertinger, V.
(2022) Journal of Alloys and Compounds 918: 165567
https://doi.org/10.1016/j.jallcom.2022.165567

Effects of bonding pressures on microstructure and mechanical properties of silver–tin alloy powders synthesized by ball milling for high-power electronics packaging
Huang, W. C., Tsai, C. H., Lee, P. T. and Kao, C. R.
(2022) Journal of Materials Research and Technology 19: 3828-3841
https://doi.org/10.1016/j.jmrt.2022.06.116

Structural and thermal properties of Sn–Ag alloys
Manasijević, D., Balanović, L., Marković, I., Gorgievski, M., Stamenković, U., Đorđević, A., Minić, D. and Ćosović, V.
(2021) Solid State Sciences 119: 106685
https://doi.org/10.1016/j.solidstatesciences.2021.106685

Formation of a Diffusion Barrier-Like Intermetallic Compound to Suppress the Formation of Micro-voids at the Sn-0.7Cu/Cu Interface by Optimal Ga Additions
Yang, T.-L., Liu, Y.-c., Yang, C.-h., Kuo, Y.-k. and Lin, S.-k.
(2020) JOM Journal of the Minerals, Metals and Materials Society 72(10): 3538-3546
https://doi.org/10.1007/s11837-020-04302-5

The study of Sn-45Bi-2.6Zn alloy before and after thermal aging
Zhou, S., Yang, C. H., Shen, Y. A., Lin, S. K. and Nishikawa, H.
(2019) 2019 International Conference on Electronics Packaging, ICEP 2019, Institute of Electrical and Electronics Engineers Inc.
https://doi.org/10.23919/ICEP.2019.8733417

The newly developed Sn–Bi–Zn alloy with a low melting point, improved ductility, and high ultimate tensile strength
Zhou, S., Yang, C. H., Shen, Y. A., Lin, S. K. and Nishikawa, H.
(2019) Materialia 6
https://doi.org/10.1016/j.mtla.2019.100300

Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloy
Zhou, S., Yang, C. H., Lin, S. K., AlHazaa, A. N., Mokhtari, O., Liu, X. and Nishikawa, H.
(2019) Materials Science and Engineering A 744: 560-569
https://doi.org/10.1016/j.msea.2018.12.012

A computational thermodynamics-assisted development of Sn-Bi-In-Ga quaternary alloys as low-temperature Pb-free solders
Yang, C. H., Zhou, S., Lin, S. K. and Nishikawa, H.
(2019) Materials 12(4)
https://doi.org/10.3390/ma12040631

Interfacial reactions of 68In–32Bi, 50In–50Bi and 33In–67Bi low melting alloys on Cu substrates
Tseng, T. H., Yang, C. H., Chiang, J. Y., Huang, J. J., Chen, C. H., Lin, S. K., Wang, C. M. and Wu, A. T.
(2019) Materials Science and Engineering A 759: 506-513
https://doi.org/10.1016/j.msea.2019.05.074

Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology
Shen, Y. A., Zhou, S., Li, J., Yang, C. H., Huang, S., Lin, S. K. and Nishikawa, H.
(2019) Materials and Design 183
https://doi.org/10.1016/j.matdes.2019.108144

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